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[/] [bu_pacman/] [tags/] [arelease/] [test_memory_map.map] - Rev 6
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Release 10.1 Map K.31 (nt)
Xilinx Map Application Log File for Design 'test_memory'
Design Information
------------------
Command Line : map -ise X:/Display_Controller/Display_Controller.ise -intstyle
ise -p xc3s200-ft256-4 -cm area -pr off -k 4 -c 100 -o test_memory_map.ncd
test_memory.ngd test_memory.pcf
Target Device : xc3s200
Target Package : ft256
Target Speed : -4
Mapper Version : spartan3 -- $Revision: 1.1.1.1 $
Mapped Date : Thu Nov 20 21:07:08 2008
Mapping design into LUTs...
Running directed packing...
Running delay-based LUT packing...
Running related packing...
Design Summary
--------------
Design Summary:
Number of errors: 0
Number of warnings: 4
Logic Utilization:
Logic Distribution:
Number of Slices containing only related logic: 0 out of 0 0%
Number of Slices containing unrelated logic: 0 out of 0 0%
*See NOTES below for an explanation of the effects of unrelated logic.
Number of bonded IOBs: 10 out of 173 5%
Number of RAMB16s: 1 out of 12 8%
Peak Memory Usage: 125 MB
Total REAL time to MAP completion: 7 secs
Total CPU time to MAP completion: 1 secs
NOTES:
Related logic is defined as being logic that shares connectivity - e.g. two
LUTs are "related" if they share common inputs. When assembling slices,
Map gives priority to combine logic that is related. Doing so results in
the best timing performance.
Unrelated logic shares no connectivity. Map will only begin packing
unrelated logic into a slice once 99% of the slices are occupied through
related logic packing.
Note that once logic distribution reaches the 99% level through related
logic packing, this does not mean the device is completely utilized.
Unrelated logic packing will then begin, continuing until all usable LUTs
and FFs are occupied. Depending on your timing budget, increased levels of
unrelated logic packing may adversely affect the overall timing performance
of your design.
Mapping completed.
See MAP report file "test_memory_map.mrp" for details.