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[/] [phr/] [trunk/] [doc/] [financiamiento/] [adec/] [informes/] [informe_final/] [informe_final.toc] - Rev 134

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\select@language {spanish}
\contentsline {section}{\numberline {1}Hardware}{2}
\contentsline {subsection}{\numberline {1.1}Plataforma de Hardware Reconfigurable (PHR)}{3}
\contentsline {subsubsection}{\numberline {1.1.1}Recursos de \textsl {hardware}}{3}
\contentsline {subsubsection}{\numberline {1.1.2}Esquem\IeC {\'a}tico}{4}
\contentsline {subsubsection}{\numberline {1.1.3}\textsl {Printed Circuit Board} (PCB)}{4}
\contentsline {subsection}{\numberline {1.2}S3Power}{11}
\contentsline {subsubsection}{\numberline {1.2.1}Esquem\IeC {\'a}tico y PCB}{11}
\contentsline {subsection}{\numberline {1.3}OOCDLink}{13}
\contentsline {subsubsection}{\numberline {1.3.1}Esquem\IeC {\'a}tico y PCB}{13}
\contentsline {subsection}{\numberline {1.4}Gastos en recursos de \textsl {hardware}}{15}
\contentsline {subsubsection}{\numberline {1.4.1}Distribuidor de componentes electr\IeC {\'o}nicos}{15}
\contentsline {subsubsection}{\numberline {1.4.2}Empresas de trasporte}{15}
\contentsline {subsubsection}{\numberline {1.4.3}Fabricante de PCB}{15}
\contentsline {subsection}{\numberline {1.5}Observaciones}{16}
\contentsline {subsubsection}{\numberline {1.5.1}Retos}{16}
\contentsline {section}{\numberline {2}Software}{18}
\contentsline {subsection}{\numberline {2.1}Herramientas utilizadas}{18}
\contentsline {subsection}{\numberline {2.2}Desarrollo de \textsl {Scripts}}{19}
\contentsline {subsection}{\numberline {2.3}Repositorio del proyecto}{19}
\contentsline {subsection}{\numberline {2.4}Observaciones}{19}
\contentsline {section}{\numberline {3}Conclusiones}{20}

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